Research on low-temperature brazing joints of copper and ceramics
 
                 
                
                    
                                        
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Graphical Abstract
 
                                        
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Abstract
    The ceramic surface was metallized by copper plating on the ceramic surface. Sn99Ag0.3Cu0.7 solder paste was used to braze the copper plated ceramic with copper under the condition of a temperature of 227℃ and insulation for 2minutes. The brazed joint was observed and analyzed using an optical microscope and a scanning electron microscope. The experimental results show that copper alloy and ceramic can form a metal compound layer through brazing at low temperatures, achieving effective welding. The strength of the brazed joint is 13.2MPa.
 
                                        
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