WANG Fa, LIU Meichuan, CHEN Xuanru, LI Jiaping, ZHOU Jialing, YU Xueyong, DAI Jun. Research on low-temperature brazing joints of copper and ceramics[J]. MW Metal Forming, 2025, (1): 27-30.
Citation: WANG Fa, LIU Meichuan, CHEN Xuanru, LI Jiaping, ZHOU Jialing, YU Xueyong, DAI Jun. Research on low-temperature brazing joints of copper and ceramics[J]. MW Metal Forming, 2025, (1): 27-30.

Research on low-temperature brazing joints of copper and ceramics

  • The ceramic surface was metallized by copper plating on the ceramic surface. Sn99Ag0.3Cu0.7 solder paste was used to braze the copper plated ceramic with copper under the condition of a temperature of 227℃ and insulation for 2minutes. The brazed joint was observed and analyzed using an optical microscope and a scanning electron microscope. The experimental results show that copper alloy and ceramic can form a metal compound layer through brazing at low temperatures, achieving effective welding. The strength of the brazed joint is 13.2MPa.
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