感应钎焊工艺对无氧铜套管结构部件钎着率、界面显微组织和力学性能的影响

Impact of Induction Brazing on Brazing Rate, Interfacial Microstructure, and Mechanical Properties of Oxygen-Free Copper Casing Components

  • 摘要: 无氧铜套管作为水冷系统中的关键传热部件,其焊接质量直接影响水冷系统的可靠性和散热效率。本文研究了感应钎焊工艺对无氧铜套管结构部件钎着率、界面显微组织和力学性能的影响。结果表明,峰值温度720 ℃,保温5 s、15 s、30 s时,焊缝钎着率良好,但在保温15 s时开始出现小尺寸气孔且保温30 s时出现明显钎料漫流缺陷。在较低峰值温度660 ℃,焊缝底端钎着率极低,C弧位置均出现气孔,但无钎料漫流。而较高峰值温度790 ℃,保温5 s时,焊缝钎着率良好,但C弧出现明显气孔且钎料漫流现象严重。整体来看,适当提高钎焊峰值温度可减小气孔尺寸、改善钎着率,但过热会导致钎料漫流,延长保温时间则普遍导致C弧气孔和钎料漫流缺陷。最佳工艺参数出现在峰值温度720 ℃、保温时间5 s。焊接工艺不会对套管结构部件整体的力学性能产生影响。

     

    Abstract: As a critical heat transfer component in water cooling systems, the welding quality of Oxygen-free copper cannula directly impacts system reliability and cooling efficiency. This study examines induction brazing’s effects on brazing rate, interfacial microstructure, and mechanical properties of small oxygen-free copper casings. Results indicate that at 720°C peak temperature with 5s, 15s, and 30s holding times, brazing rates are good, but minor porosity appears at 15s and significant solder overflow at 30s. At 660°C, the weld bottom exhibits poor brazing rates and C-arc porosity but no overflow. Conversely, at 790°C with 5s holding time, brazing rates remain high, but severe C-arc porosity and solder diffusion occur. Overall, moderately increasing the peak temperature can reduce the pore size and enhance the brazing rate. However, overheating can lead to overflow, and an excessively long holding time can result in C-arc porosity and overflow defects. The optimal parameters are 720°C peak temperature with 5s holding time. The welding process will not have an impact on the overall mechanical properties of the casing structural components.

     

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