Abstract: The ceramic surface was metallized by copper plating on the ceramic surface. Sn99Ag0.3Cu0.7 solder paste was used to braze the copper plated ceramic with copper under the condition of a temperature of 227℃ and insulation for 2minutes. The brazed joint was observed and analyzed using an optical microscope and a scanning electron microscope. The experimental results show that copper alloy and ceramic can form a metal compound layer through brazing at low temperatures, achieving effective welding. The strength of the brazed joint is 13.2MPa.