平面薄板与曲面结构的激光熔覆应力应变研究

Research on Stress and Strain of Laser Cladding on Flat Thin Plates and Curved Surface Structures

  • 摘要: 为解决平面薄板与曲面结构激光熔覆过程中因剧烈热-力耦合作用导致的残余应力集中、结构变形复杂等问题,揭示基体几何形态对熔覆层应力应变分布的调控机制,采用有限元仿真方法开展不同几何结构(平面薄板、不同曲率曲面)的激光熔覆应力应变特性研究。结果表明:当激光加热平面薄板时熔覆层熔化膨胀并挤压周围,在凝固收缩时产生的拉伸应力会牵引边缘向上翘起,随着激光功率的提高或扫描速度的降低,翘起程度显著增大;曲面结构轴向扫描的熔覆层应力应变分布受曲率影响显著,当凸面曲率由0.083增大至0.125时Mises等效应力极值由458.8MPa增大至521.6MPa,而残余压应力峰值由135.4MPa显著降低至35.4MPa;在凹面熔覆时则因“箍紧”效应形成应力平衡,不同曲率的等效应力和压应力峰值变化不明显;曲面结构周向扫描的熔覆层等效应力随着曲率增加而降低,扫描方向应力呈现“中间高、两头低”的典型特征。热-力耦合效应与基体几何约束的协同作用是导致平面薄板和曲面结构应力应变差异的核心原因,平面薄板以刚性约束主导应力演化,曲面结构则由几何曲率与约束作用共同调控应力分布。

     

    Abstract: To address the issues of residual stress concentration and complex structural deformation induced by severe thermo-mechanical coupling during laser cladding on planar thin plates and curved substrates, and to elucidate the regulatory mechanisms of substrate geometry on the stress–strain distribution within the clad layer, a finite element simulation approach was employed to investigate the stress–strain characteristics of laser cladding on components with different geometric configurations, including planar thin plates and curved surfaces with varying curvatures. The results indicate that when a planar thin plate is subjected to laser heating, the clad layer undergoes melting expansion and compresses the surrounding material; subsequently, the tensile stress generated during solidification shrinkage induces upward warping along the edges of the plate. This warping deformation becomes more pronounced with increasing laser power or decreasing scanning speed. For curved substrates subjected to axial scanning, the stress–strain distribution in the clad layer is significantly influenced by surface curvature. When the convex surface curvature increases from 0.083 to 0.125, the peak von Mises equivalent stress rises from 458.8 MPa to 521.6 MPa, whereas the peak residual compressive stress decreases markedly from 135.4 MPa to 35.4 MPa. In contrast, during cladding on concave surfaces, a stress equilibrium is established due to a "hoop-constraint" effect, resulting in insignificant variations in both the equivalent stress and the peak compressive stress across different curvatures. For curved substrates subjected to circumferential scanning, the equivalent stress in the clad layer diminishes as the curvature increases, and the stress component along the scanning direction exhibits a characteristic distribution of “higher in the center and lower at both ends”. The synergistic interplay between thermo-mechanical coupling effects and geometric constraints imposed by the substrate is the primary mechanism underlying the distinct stress–strain behaviors observed between planar thin plates and curved structures. In planar thin plates, the stress evolution is predominantly governed by rigid constraints, whereas in curved structures, the stress distribution is jointly regulated by geometric curvature and constraint effects.

     

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